Packaging Engineer jobs in Tianjin

• 2025 Intern - Packaging Engineer

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  NXP Semiconductors

  • Tianjin

  Job Description: This position is a packaging front-end R&D engineer, and will be focusing on IC (integrated circuit) packaging technology research and development, work with glob…

• 2025 Intern - Packaging Engineer

  • Save

  NXP Semiconductors

  • Tianjin

  Job Description: This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global …

• 2025 Intern - Packaging Engineer

  • Save

  NXP Semiconductors

  • Tianjin

  Job Description: This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global…

• Manufacuturing science Engineer

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  Takeda

  • Tianjin

  By clicking the “Apply” button, I understand that my employment application process with Takeda will commence and that the information I provide in my application will be processed…

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