2025 Intern - Packaging Engineer
- Tianjin
- Training
- Part-time
This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:
- New packaging technology development
- New package related process development
- Advanced material interface study
- Advanced IC package failure analysis
- Coordinate/lead development project independently
- Communication/cooperation among global teams (US/
- Pursuing in master degree
- Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
- At least CET-4 degree or equivalent English level and CET-6 is preferred.
- Intention and capability to work in a cross-functional/global team environment.
- Independent R&D capability.