Package Designer
NXP Semiconductors
- Tianjin
- Permanent
- Full-time
- Responsible for IC package design mainly focus on substrate packages and lead frame packages in accordance with industry standards and customers’ specifications- Work with business line, assembly team, supplier and subcon for spec review and provide technical consultation on package design related issues as needed
- Utilize package / die co-design tool for design for performance and manufacturability
- Work closely with team members to ensure that the design rules and standard notes are updated consistent with the existing process manufacturabilityQualification:
- Bachelor’s Degree or above in Electrical and Mechanical Engineering- Package design experience on Wire bond BGA, Flip Chip BGA, Wafer Level, Panel Level packages are preferred, with additional experience with design of lead frame is desirable- Knowledge of IC Package substrate and lead frame fabrication and assembly will be a plus- Cadence SIP or PCB Layout experience using Cadence Allegro, experience with ACAD will be a plus- Knowledge of Geometric Dimensioning and Tolerancing will be a plus- Good English written and oral communication skill, CET-6 or equivalent is a plus- Good sense of ownership and responsibility- Good self-discipline & teamwork