R&D Manager - TIM
- Shanghai
- Permanent
- Full-time
- Fundamental study on heat dissipation mechanism on microscopic interface and correlation between component and performance.
- Technology innovation to keep up with macro emerging application.
- Collaboration with process and production team to scale up formulation and mass production.
- Visit customers with commercial team together to define CTQs and conduct technical feasibility.
- Conduct experiment DOE and related performance testing.
- Project management in whole stream and collaborate with related functions to commercialize formulation.
- Benchmark the CoProducers' TIM related products.
- Maintain and develop current company intelligence for value creation.
- Actively monitor relevant local IP landscape and strengthen company IP position.
- Maintain samples, chemical substances, technical equipment, furniture and operational procedures in lab.
- Meeting the requirements of IMS/ISO and EHSS standards.
- Understand IATF 16949 related requirements; provide customers with products and services that meet requirements in accordance with legal and regulatory, customers and internal product development processes.REQUIRED QUALIFICATION- Ph.D in Polymer, Chemistry or Material Science is preferred, exceptionally outstanding Master's degree may also be considered.
- Strong expertise in polymer and silicone chemistry preferred (Thermal Curable, RTV-2 Hydrosilylation, RTV-1 Condensation).
- The candidates with expertise in semiconductor adhesive (silicone, epoxy, acrylic, BMI etc. related ) will be a plus.
Knowledge/Requirement- Solid knowledge of powder, electronic adhesive and TIM (silicone-based or non-silicone-based) preferred.
- Strong knowledge of silicone, acrylic, epoxy, polyurethane, MS based adhesive.
- Strong expertise in formulation development for electronics.
- Familiar with filler treatment know-how particularly thermal conductive filler.
- Familiar with the R&D and IP procedures.
- Good cross-function communication and teamwork ability.
- Fluent command of written and spoken English.
- Good IT skills (MS Windows, MS Office, MS Outlook).
Soft skills:
- Systematic thinking, open-minded, pro-active, communicational and team workable personality including intercultural competence.
Experience- At least 5-year related working experience in TIM and/or adhesive applications of semiconductor, data center, AI, consumer electronics, telecommunication, e-mobility or photovoltaic and so on.
- ph.D is preferred, and senior level master with strong experience is acceptable.Contact Person: Emily HongWe are looking forward to your online application.
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