DCP-Power Electronical HW Engineer(Global)-Shenzhen
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- China
- Permanent
- Full-time
Senior Power Electronics Engineer (Shenzhen)
Location: Shenzhen, China
Company: Foreign-invested enterprise
Responsibilities
1. Power Electronics Product Development
o Lead the design and development of power electronics products, such as inverters, converters, charging modules, and power management systems.
o Responsible for topology design, component selection, magnetic component design, and thermal design to ensure system performance and reliability.
2. Technical Verification & Testing
o Plan and perform electrical performance, safety, and EMC tests; drive prototype validation and functional debugging.
o Analyze and resolve technical issues related to electrical design, thermal management, and EMI/EMC during the development process.
3. Project Management & Cross-functional Collaboration
o Participate in project initiation and technical evaluation, define development plans, and ensure on-time delivery.
o Collaborate closely with global R&D teams, suppliers, and manufacturing teams to support the entire product lifecycle from R&D to mass production.
4. Standards & Compliance
o Ensure designs comply with international and domestic standards (e.g., IEC, UL, GB).
o Stay up to date with industry trends, advanced technologies, and new components in the field of power electronics, and apply them to product development.
5. Team Support & Guidance
o Provide technical coaching and training to junior and mid-level engineers.
o Participate in technical reviews and intellectual property development (e.g., patents), contributing to overall R&D capability enhancement.
Qualifications
- Master's degree or above in Power Electronics, Electrical Engineering, Automation, or related fields.
- 5+ years of experience in power electronics product development; background in high-power supplies, PV/storage inverters, EV chargers, or automotive powertrain electronics is a plus.
- Solid knowledge of common power electronics topologies (e.g., Buck/Boost, LLC, Full-Bridge, Three-Level). Skilled in magnetic component design and thermal simulation.
- Proficient in applying and driving power devices (IGBT, SiC, GaN).
- Strong English communication skills, capable of working effectively with overseas R&D teams.
- Excellent problem-solving, analytical, and innovative thinking skills.