Vice President, Technology - 3D IC Packaging

Michael Page View all jobs

  • China
  • Permanent
  • Full-time
  • 6 days ago
  • Apply easily
This role oversees technology strategy, roadmap development, and engineering execution for advanced packaging technologies, including 3D IC and heterogeneous integration.
  • Define the company's advanced packaging technology roadmap, covering 3D IC, TSV, hybrid bonding, advanced substrates, and chiplet integration.
  • Lead R&D, engineering, and cross‑functional teams to develop new packaging platforms and manufacturing processes.
  • Evaluate emerging technologies and drive feasibility studies, prototyping, and customer qualification programs.
  • Partner with customers to understand product requirements and translate them into manufacturable technical solutions.
  • Oversee technology transfer from R&D to high‑volume manufacturing, ensuring quality, reliability, and cost objectives are met.
  • Maintain technical partnerships with foundries, substrate suppliers, equipment vendors, and research institutes.
  • Develop and lead a senior engineering organization, including talent development, resource allocation, and succession planning.
  • Provide technical input for business development, customer engagement, and long‑term strategic planning.
Shape the company's technology direction across 3D packagingDrive strategic programs that influence major customers, partnerships
  • Bachelor's degree in engineering; Master's or Ph.D. in Materials, Electrical Engineering, Microelectronics, Packaging, or related field preferred.
  • 15+ years of experience in semiconductor packaging or OSAT, with significant exposure to 3D IC, TSV, hybrid bonding, or heterogeneous integration.
  • Proven track record in technology development, advanced packaging platform ownership, or factory ramp‑up.
  • Strong understanding of thermal, mechanical, electrical, and reliability considerations in advanced packages.
  • Familiarity with HBM integration, logic‑memory stacking, chiplet architectures, and advanced substrate technologies.
  • Experience managing large engineering teams and cross‑functional technical programs.
  • Ability to engage directly with customers and external partners on technical and strategic topics.
  • Strong communication, leadership, and decision‑making skills.
Our client is a semiconductor OSAT company focused on developing advanced assembly and packaging solutions for global customers.
  • A senior executive role with broad influence over the company's technology direction and long‑term roadmap.
  • Opportunity to build and scale advanced packaging capabilities that support major global semiconductor customers.
  • Competitive compensation, performance incentives, and executive‑level benefits.

Michael Page