Responsibilities: Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoC’s Work with architects and systems engineering to define the part. Generate and analyze …
Role Summary: Package Innovation (PI) is focusing on package/process development, Package design center is under Package Innovation to cover package designs including Lead frame,…
Job Summary: Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementatio…
Responsibilities Develop RTL for digital IPs or subsystems based on architectural requirements Develop functional timing constraints for IPs Run IP check flows of Lint, …
Join us to be part of the Wireless Connectivity Solutions team, acting as a game changer in the Connected world. Wireless Connectivity Solution Product line has a leading positio…
Responsibilities : The candidate will be a senior FAE supporting NXP’s applications processors (i.MX, S32G & etc.) & solutions. You drive demand creation and design-in activity a…