Process Integration Lead- Front End

• Process integration / device lead in technology development and transfer projects.
• Collaborate with internal business, design, design enablement and technology teams.
• Lead technical interface with external foundries in China.
• Drive projects towards timely completion to serve NXP business needs.

• Master or Ph.D. in Electrical Engineering, Solid State Physics or Material Science.
• In-depth knowledge of advanced HV and BCD (Bipolar CMOS DMOS) technologies.
• More than 10 years of technology development experience in process integration or device engineering.
• Extensive experience in leading development projects and working with internal stakeholders and foundries.
• Excellent communication skill and team player.
• Understanding and speaking in Mandarin.
• Candidate should be able to communicate fluently in English

NXP Semiconductors