Principal Engineer, Product Engineering
Western Digital View all jobs
- Shenzhen, Guangdong
- Permanent
- Full-time
- Analyze manufacturing data generated throughout HDD and key components production to identify opportunities for improving yield, cost, quality, and reliability.
- Perform root cause analysis on yield, performance or quality issues; collaborate cross-functionally with design, process & manufacturing teams to implement effective engineering & operational solutions.
- Provide characterization and analytical support for design and process change qualifications; proactively identify potential issues, risks, concerns prior to volume production ramp-up.
- Contribute to the development of standardized manufacturing data analytics methodologies and workflows, enabling scalable and organization-wide adoption of data-driven practices.
- Master’s degree or above in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Automation, or related disciplines (exceptional candidates with a Bachelor’s degree and strong project experience will also be considered).
- Abundants of experience in HDD or semiconductor industry. Solid understanding of magnetic recording principles, head/media design & related manufacturing processes is highly preferred.
- Proficient in data analysis tools & methodologies, hands-on experience with JMP, SAS, Python, and Spotfire is a plus.
- Strong communication and teamwork skills, with English proficiency sufficient for professional working environments.
- Experience with hard disk drive integration, head device process, head media characterization
- strong understanding of magnetic recording physics, magnetic reader/writer/NFT fundamentals, and media technology
- Experience with head/media manufacturing processes (wafer, slider, HGA, media)
- Proficiency in data analysis tools (e.g., JMP, Python) and statistical methods
- Demonstrated ability to lead cross‑functional engineering efforts
- Strong communication, documentation, and configuration‑management skills
- Experience in HDD development, NPI, or component engineering preferred