MGR II R&D/PRODUCT DVL ENGINEERING
- Shanghai
- Permanent
- Full-time
- Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
- Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
- Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
- Create actionable recommendations based upon design reviews and simulation results.
- Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community.
- Align the technology roadmap with the market trends, customer needs, and implement accordingly.
- Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.
- Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
- Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.
- Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.
- Bachelor's degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
- Generally requires 10 years of relevant work experience in electrical Design, RF design or PCB design
- Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment
- A solid understanding of electromagnetic theory and electrical circuit behavior
- Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
- Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
- Proficient with high-speed test equipment (VNA, TDR, BERT)
- Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
- Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
- Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
- Fluent in English (both verbal and written)
- Ability to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies.
- Expert problem solver - able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures
- Proficient in presenting technical solutions to customers and upper management
- Demonstrated experience leading/developing a team of 5+ experienced professionals who exercise latitude and independence in their assignments with accountability for team performance, project delivery, and resource allocation.
- Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance.