Field Service Engineer
Element Solutions View all jobs
- China
- Permanent
- Full-time
- Wafer Level Packaging - Revolutionizing wafer fabrication processes for enhanced efficiency and performance
- Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry
- Electronics Assembly Solutions - Innovating semiconductor, surface mount technology, and power electronics assembly for unparalleled reliability
- Advanced Materials and Joining - Engineering polymer and metal joining solutions for optimally performing circuits
- Film & Smart Surface Solutions - Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability
- Micromax – Elevating electronics through high-performing, specialized inks and pastes
- Develops new applications by in-depth understanding of product properties, market demand, and technology trend.
- Thick film paste modification to meet customized performance or process needs.
- Support sales and marketing team to create differentiation on product values to maintain or gain new business.
- Provide proactive technical service to the assigned customer, application, and product segment.
- Solve customer complaint by providing in time solution on application process optimization, product performance, and quality improvement.
- Support new product development by providing accurate VOC & CTQ collection and timely lab testing of prototypes.
- Master’s degree in Material Science, Chemistry, Electronics
- 5+ years of working experience in thick film electronics, e.g., thick film pastes, passive components, hybrid circuit for automotive or high frequency communication, electronic conductive adhesives, etc.
- Product design or modification experience will be a plus.
- Good English communication skills
- Strong team building, interpersonal and communication skills for customer intimacy
- Willingness to have frequent business trips in China