Technician 3, Engineering

SanDisk View all jobs

  • Shanghai
  • Permanent
  • Full-time
  • 7 days ago
  • Apply easily
Company DescriptionSanDisk is a global leader in NAND flash memory and advanced storage solutions, with a strong legacy of innovation in semiconductor technology. As an independent company focused on flash memory, SanDisk designs and manufactures cutting-edge NAND devices, SSDs, and storage solutions for data center, mobile, automotive, and consumer applications. With deep expertise in wafer fabrication, device design, and advanced packaging, SanDisk continues to drive the future of data storage.Job DescriptionWe are seeking a Die Preparation (DP) Technician to support semiconductor backend and R&D activities through high‑quality die preparation processes, including wafer dicing and back grinding. This role is essential to ensuring die quality, yield, and readiness for downstream assembly, packaging, and engineering evaluation.The position works closely with process engineering, package development, manufacturing, and R&D teams in a cleanroom and lab environment.
  • Perform die preparation processes, including:
  • Wafer dicing (blade and/or laser, as applicable)
  • Back grinding / wafer thinning
  • Set up, operate, and monitor DP tools and equipment according to defined process specifications.
  • Inspect wafers and dies for process quality and defects, and report abnormalities.
  • Support process development, optimization, and troubleshooting activities.
  • Maintain process documentation, logs, and sample traceability.
  • Perform routine tool checks, basic maintenance, and housekeeping.
  • Collaborate with process, package, and manufacturing engineers to support development and production needs.
QualificationsRequired Qualifications
  • Diploma, Associate or Bachelor’s degree in Mechanical Engineering, Electronics, Materials, Manufacturing, or related technical fields, or equivalent hands‑on experience.
  • Hands‑on experience with die preparation processes is required.
  • Familiarity with wafer dicing and back grinding equipment.
  • Ability to work in a cleanroom environment.
  • Strong attention to detail and execution discipline.
  • Basic English communication skills for work instructions and documentation.
Preferred Qualifications:
  • Experience with advanced semiconductor packaging or backend assembly processes.
  • Experience supporting NAND, ASIC, or advanced semiconductor products.
  • Familiarity with pilot line or R&D manufacturing environments.
  • Experience with process control and yield awareness.
Additional InformationJoin SanDisk to work on real silicon, real products, and real impact—from NAND device physics to advanced packaging and integration. Here, engineers are trusted with deep technical ownership, hands-on tools, and cross‑functional collaboration with fab, design, and R&D teams worldwide. If you are driven to solve hard semiconductor problems and shape the future of flash technology, SanDisk is where your work truly matters.

SanDisk